Proprietary 5D FMCW LiDAR · On a chip

The perception layerfor machines thatcannot be wrong.

SVI puts defense-grade 5D LiDAR and edge AI on a single silicon chip — so machines don't just see a surface, they perceive depth, motion, and what lies beneath it, in real time.

Contact us Explore the technology
Multiple U.S. patents pending Ex-DARPA · Ex-NASA OSD ManTech selected
Fig. 01 · Platform in operationLive capture
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Dual-Chirp 5D sensing in the field — depth, velocity, and material resolved in a single pass.
SVI AI Sensing Platform — capability data Platform Rev 2026 Patent pending
SVI AI Sensing Platform capability data, revision 2026.
No.PropertyValueRemark
01Sensing dimensions5DGeometry · range · velocity · material · sub-surface
02Beam architectureDual-ChirpTwo beams, one modulated 180° out of phase
03Form factorOn-chipSilicon photonics — low SWaP, scalable, industry-agnostic
04IntelligenceEdge AIOn-board ML anomaly detection & classification
05Performance gain10–100×Vs. everyone else. We counted.
02 · Technology

This isn't your father's LiDAR.
We invented a new way to see.

Conventional LiDAR fires one beam and waits for the bounce — like a flashlight in fog. It reads a surface and guesses at the rest. Our proprietary architecture changes the physics of the measurement itself.

Dual-Chirp FMCW

Two coherent beams, one modulated 180° out of phase. Their interference turns light into signal — suppressing noise and lifting detection sensitivity by orders of magnitude.

5D on a chip

Geometry, range, Doppler velocity, and polarization captured in a single pass — integrated into manufacturable silicon. Compact, power-efficient, and agnostic to the industry it serves.

On-board edge AI

Embedded AI/ML detects and classifies anomalies in real time, at the sensor. Decisions land in milliseconds — no round trip to the cloud, no dependence on connectivity.

Fig. 02 · Dual-Chirp FMCWΔφ = 180°
BEAM ABEAM B · 180°
Two coherent beams in phase opposition. Their interference resolves into a 5D signal — depth, velocity, and material — that single-beam LiDAR cannot recover.
03 · What 5D sees

Most sensors see a surface. Ours sees inside. Yes, inside.

01

Geometry

02

Range

03

Velocity

04

Material

05

Sub-surface

04 · Competitive advantage

We're not ahead of the competition. There isn't one.

Capability comparison across sensing approaches.
Capability Vision systems Laser triangulation SVI Dual-Chirp AI
Surface detectionYesYesYes
Inner-layer detectionNoNoYes
Real-time speedModerateSlowHigh
Material discriminationLimitedNo5D native
AI defect classificationLimitedNoIntegrated
SLAM-independent localizationNoNoYes

10–100× on cost, speed, and efficiency. That's not a lead — that's a different sport. The table plays it straight so we don't have to.

05 · Applications

One platform. Many missions.

Application 01

Secure ID manufacturing

Application 02

Counter-UAS (C-UAS)

Application 03

Defense inspection & sustainment

Application 04

Biometric optics

Dual-use expansion The same silicon scales into BVLOS drones, eVTOL air mobility, first-responder navigation, vehicle checkpoints, and non-invasive MedTech imaging — one perception layer, many markets.
The perception layer
An autonomous machine is only as safe as its perception.

Vision alone sees a surface and infers the rest. Our 5D perception layer measures geometry, motion, and material — inside and out — so the next decision is grounded in physics, not a guess. Exactly one company on the planet can put that on a chip. You're on its website.

Built by operators from
DARPANASASOCOMSmiths DetectionL-1 IdentityCaltech
SVI. We put the intel in intelligent AI.
06 · Contact

Talk to the only ones who can do this.

For technical briefings, OEM and integration partnerships, defense programs, or press — reach the team directly.

Gregory Steinthal
Founder & CTO
gregory.steinthal@svi.tech
Marc Brody
Chief Executive Officer
marc.brody@svi.tech